The active devices in thin film integrated circuits, namely transistors, have two material structures: one is a thin film field-effect cadmium sulfide or cadmium selenide transistor, and the other is a thin film thermionic amplifier. More practical thin film integrated circuits use hybrid technology, that is, thin film technology is used to prepare passive components and connections between circuit components on glass, glass-ceramics, glazed and polished alumina ceramic substrates, and then integrate integrated circuits, Chips of active devices such as transistors and diodes, as well as power resistors, large-capacity capacitors, inductors and other components that do not use thin-film technology can be assembled by thermocompression welding, ultrasonic welding, beam lead or bump flip-chip welding, etc. Into a complete integrated circuit.
